L-COS compatible bonding device vacuum bonding device
We have various types ranging from inline machines to standalone types equipped with cassette loaders and unloaders.
Each substrate is transferred to the crimping section by each robot, where auto-alignment is performed and crimping is carried out. After crimping, alignment is performed again, and the UV material is cured by UV irradiation, temporarily fixed, and then discharged downstream. It supports various types of substrates, such as wafers, and has a variety of types ranging from inline machines to standalone types equipped with cassette loaders and unloaders.
- Company：常陽工学
- Price：Other
